- 10-Year Lifecycle Guarantee
Modular Industrial PCs & Edge AI Computers for Globale OEM
BITECH specializes in modular SOM architecture, 2.5KV galvanic isolation, and guaranteed 10-year lifecycle support for industrial OEM projects. Our engineering philosophy centers on determinism—predictable, repeatable behavior under all operating conditions.
Unlike consumer-grade computing platforms, our industrial PCs are designed to survive validation cycles, component shortages, and decade-long deployments. The SOM + Carrier Board architecture decouples compute logic from I/O expansion, enabling CPU upgrades without hardware redesign or re-certification.
This architectural approach is critical for industries with long product lifecycles— energy infrastructure, medical devices, transportation systems, and industrial automation—where platform stability directly impacts total cost of ownership and operational risk.
AX-660EBT Platform
BITECH Engineering Pillars: Resilience & Deterministic Architecture
Three engineering pillars define every platform we design. These aren’t marketing bullet points—they’re the measurable criteria our engineering team uses to evaluate every design decision, component selection, and validation protocol.
Modular SOM Architecture (AX-130BT & AX-134BT)
The System-on-Module (SOM) + Carrier Board topology physically separates compute logic from I/O expansion. This architectural decision enables CPU upgrades—from 4th to 14th Gen Intel—on a fixed carrier board footprint, eliminating the need for mechanical redesign or re-certification when upgrading processing power.
2.5KV Galvanic Firewall Protection
Industrial environments generate ground loops, EMI surges, and transient voltage spikes that destroy unprotected compute modules. Our integrated galvanic isolation across COM, CAN, and DIO interfaces creates an electrical “firewall” that contains faults at the interface level—preventing cascade failures that would otherwise take down entire systems.
Native CAN Bus Support Across All Speeds
The AX-130BT integrates a native CAN bus controller directly at the hardware layer, bypassing the latency and jitter of commercial USB-to-CAN bridges. Engineered for Windows-based SCADA and fleet management, it ensures deterministic command distribution from the control cabinet to factory floor PLCs.
All-Speed Compatibility: Natively supports low, medium, and high-speed CAN networks without performance degradation.
4000V Galvanic Isolation: Blocks ground loops and surges from high-power inverters.
60Ω Signal Integrity: Delivers precise physical layer diagnostics to eliminate reflection-induced bit errors.
Modular SOM Architecture
2.5KV Galvanic Isolation Firewall
Extreme Resilience & Thermal Management
Industrial Computing Product Platforms
BITECH offers three product families engineered for different deployment scenarios—from climate-controlled control cabinets to outdoor edge nodes exposed to extreme weather, vibration, and electromagnetic interference.
Modular Embedded PCs (AX Series)
The AE and AX series represent our flagship modular architecture. These platforms use a SOM + Carrier Board topology that enables 10+ year lifecycle support with CPU upgrade paths spanning Intel 4th through 14th generation processors. The decoupled architecture means you can refresh compute performance without mechanical redesign or I/O re-certification.
Edge AI Computing Stations (32 TOPS NPU)
Purpose-built for vision AI and real-time analytics at the edge. The AE-3588 series delivers up to 32 TOPS NPU power in a fanless form factor that operates from -10°C to +60°C. HDMI input/output synergy enables simultaneous video capture and display—ideal for machine vision, defect detection, and traffic analytics applications.
Rugged Control Units & HMI (AE-660EBT)
Industrial Panel PCs and Machine Vision controllers with front IP65 protection. These integrated HMI solutions combine operator interfaces with compute power in a single enclosure—reducing integration complexity and cabling overhead in space-constrained installations.
Modular Embedded PCs
Long-life reliability with swappable CPU modules. SOM + Carrier Board architecture enables 10+ year lifecycle support with CPU upgrade paths.
Edge AI Computing
Up to 32 TOPS NPU power for real-time outdoor analytics. Fanless design with HDMI input/output synergy for vision AI applications.
Rugged Control Units
Industrial Panel PCs and Machine Vision controllers with front IP65 protection. Integrated HMI solutions for operator interfaces.
Application-Specific Industry Solutions
Purpose-built computing foundations for mission-critical infrastructure— where determinism and reliability are non-negotiable. Each solution architecture addresses specific industry challenges with validated hardware configurations and reference designs.
Energy & Smart Grid Infrastructure
Smart grid and power distribution systems require computing platforms that survive 10+ year validation cycles without forced hardware migrations. Our 2.5KV isolated gateways contain electrical faults at the interface level, preventing cascade failures in high-voltage environments.
AMR & Robotics Vision Controllers
AMR and AGV applications demand low-latency, deterministic compute for SLAM, perception, and motion control. Our Dual CAN Bus architecture provides isolated communication paths for safety-critical and operational networks—essential for functional safety certification.
Machine Vision for Tablet Housing Printing
Unattended edge nodes in harsh environments eliminate truck-roll maintenance. Our passive thermal architecture operates from -40°C to +70°C without active cooling—critical for solar farms, traffic monitoring, and remote sensing applications where MTBF directly impacts operational economics.
Energy & Grid
2.5KV isolated gateways for smart substations and power distribution. Designed for 10+ year validation cycles with decoupled compute architecture.
Robotics & AMR
Low-latency Dual CAN Bus for autonomous navigation. Deterministic compute foundation for SLAM, perception, and motion control integration.
Outdoor Infrastructure
Maintenance-free 5G AI nodes for harsh environments. Passive thermal architecture survives -40°C to +70°C without truck rolls.
Technical Resources & Documentation for Engineers
Self-service resources for system architects and integration teams. We understand that engineering decisions require detailed technical data—not marketing summaries. Our documentation philosophy prioritizes completeness over brevity.
Mechanical Integration
3D STEP models and 2D DXF drawings enable mechanical engineers to validate fit, clearance, and thermal budgets before procurement. Every mounting dimension, connector position, and airflow path is documented to sub-millimeter precision.
Software Stack
Board Support Packages (BSPs) are available for Ubuntu, Debian, and RT-Linux. Our SDKs include GPIO libraries, CAN bus utilities, and hardware watchdog APIs—all tested against our reference validation suite before release.
Technical Documentation
In-depth whitepapers cover thermal architecture, EMC compliance, galvanic isolation topology, and lifecycle management strategies. These documents are written by our engineering team—not marketing—and include the technical depth required for informed platform selection.
3D STEP Models & Mechanical Integration
Mechanical CAD files for integration planning
Linux BSPs & SDK Software Stacks
Board support packages for Ubuntu, Debian, RT-Linux
CAN Bus 60Ω Rule Diagnostics & Whitepapers
In-depth engineering documentation and guides
Technical Deep Dives for Industrial Engineers
Subscribe to receive in-depth technical articles on industrial computing architecture, lifecycle management, and engineering best practices. Written by engineers, for engineers— no marketing fluff.
- SOM + Carrier Board architecture deep dives
- EOL risk mitigation strategies
- Thermal, EMC, and validation engineering
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Monthly technical digest
Global Certifications & Quality Assurance
Every unit passes our 18-hour full-load burn-in testing protocol before shipment. This isn’t sampling—it’s 100% coverage with full traceability for each serial number. We believe infant mortality failures should occur in our factory, not your deployment site.
Global Certifications
Our platforms are certified to CE, FCC, RoHS, and UKCA standards. For applications requiring extreme environmental validation, we offer MIL-STD-810G tested configurations that have been validated for shock, vibration, temperature cycling, and humidity resistance.
100% 18-Hour Full-Load Burn-in Protocol
Every industrial PC undergoes comprehensive thermal stress testing, I/O validation, and continuous load operation at maximum rated temperature. The 24-hour duration catches marginal components and workmanship defects that would otherwise manifest as field failures during the first months of operation.
Lifecycle Traceability & Documentation
Each unit ships with complete test records, component lot tracking, and firmware version documentation. For regulated industries requiring long-term audit trails, we maintain production records for the full lifecycle of each platform family.
100% 18-Hour Full-Load Burn-in
Every industrial PC undergoes thermal stress testing, I/O validation, and continuous load operation. No sampling—100% coverage with full traceability.
Technical Support & Architecture FAQ
How does BITECH ensure a 10-year product lifecycle for industrial computers?
BITECH utilizes a modular SOM (System-on-Module) + Carrier Board architecture. By decoupling the compute logic from I/O expansion, we allow for CPU and memory upgrades within the same mechanical footprint, eliminating the need for system redesigns or re-certifications during long-term deployments.
Why is 2.5KV galvanic isolation critical in industrial computing?
In industrial environments, ground loops, EMI surges, and transient voltage spikes are common. Our integrated 2.5KV galvanic isolation creates an electrical "firewall" across COM, CAN, and DIO interfaces, protecting the core processor from cascade failures caused by external faults.
How does BITECH handle thermal management in fanless designs?
We employ a unibody thermal design that utilizes high-conductivity alloy casings as a passive heatsink. This mechanical approach maximizes heat dissipation from the CPU to the environment, enabling consistent, throttled-free performance in extreme temperature ranges from -40°C to +80°C without mechanical failure points.
Ready to Discuss Your Project?
Talk directly with our engineering team about your application requirements, customization needs, and lifecycle planning.