Edge AI Computers & Industrial PCs for Environments That Break Standard Hardware
BITECH manufactures edge AI computers, fanless box PCs, and rugged panel PCs for deployments where standard hardware fails — on vehicles and mobile robots, in outdoor and roadside enclosures, on energy infrastructure, and on factoryfloors. Isolated I/O, wide-range DC power, fanless wide-temperature construction, and a 10-year lifecycle commitment, engineered and built in Shenzhen.
Most of our work starts with a deployment, not a part number. When no catalogue product fits, we engineer the board to your envelope — custom dimensions, I/O and BIOS — in 1–3 months, from 100 units

Engineering Pillars
Industrial PC engineering: resilience & deterministic architecture
Three measurable criteria drive every design decision in our fanless industrial computers. Full technical depth lives in the linked whitepapers.
Modular SOM Architecture (AX Series)
Intel 4th–14th gen · one carrier board
Swap the compute module, keep the carrier board — a core feature of our AX series. Upgrade CPUs without mechanical redesign or re-certification, ensuring a guaranteed 10-year supply footprint
4000V Galvanic Isolation Firewall
COM · CAN · DIO – AE series & ODM variants
An electrical firewall stops ground loops and surges at the interface — before they cascade into the core.
Native CAN bus, all speeds
4000 V isolation · 60 Ω integrity
Hardware-level CAN controller with deterministic timing — no USB bridges, no jitter, no reflection errors.
Modular Architecture
AX-230BT /234BT/660EBT platform
CARRIER BOARD
Engineering Access
What you’d normally be told no about
The requests that get declined elsewhere are the ones this company was built around. Four we hear most often — and what actually happens when you ask.
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Mechanical Usually: no
Change the board dimensions to fit an enclosure we already tooled.
Custom-dimension mainboard, designed to your envelope.
1–3 months from requirements review to first articles.
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Interfaces Usually: no
Add two isolated CAN ports and drop the serial ports we don’t use.
Carrier I/O respecified at PCB level.
Native controllers on the board — not adapted with dongles or USB bridges.
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Volume Usually: no
We need 200 units, not 5,000.
Turnkey OEM from 100 units.
NRE quoted upfront, before you commit to anything.
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Supply Usually: no
Keep this exact BOM available for eight years.
BOM lock under formal PCN.
Last-time-buy notice issued before any component change.
An engineer, not a sales desk, replies within 48 hours.
Hardware Platforms: Embedded Box PCs, Edge AI & Industrial Touch Panels
Three families, one engineering standard.

Modular embedded PCs

Edge AI computing

Rugged Industrial Panel PCs & HMI
Quality Assurance
Quality assurance & global certifications
Infant mortality belongs in our factory, not your site.
Every unit passes an 18-hour full-load burn-in before shipment — 100% coverage, not sampling — with serial-number traceability, component lot tracking, and firmware documentation retained for the full platform lifecycle.


Tailored to Your Architecture: BITECH OEM/ODM Services
When standard industrial PCs limit your application, BITECH delivers exact-fit hardware engineering — from minor branding to full-scale, ground-up development.
Deep ODM Engineering
Full-Scale CustomizationOff-the-shelf form factors and I/O layouts should never dictate your software’s potential. If our standard catalog doesn’t fit your blueprint, we build what does.
Bespoke Motherboard Design
We engineer custom-dimension mainboards from scratch, embedding the exact I/O density (such as isolated CAN, RS232/485, or specific PCIe/M.2 expansions) your project demands.
Thermal Management & Mechanical Architecture
Our team designs custom rugged enclosures and runs thermal simulations to optimize heat dissipation, ensuring stable performance for high-power processors in space-constrained or harsh environments.
Kernel-Level BIOS & Firmware Customization
We develop tailored BIOS/Firmware to support specific boot sequences, optimized watchdog timers, hardware-level security, and specialized OS kernel integration (including custom Ubuntu/Debian BSPs).
Turnkey OEM Configuration
Rapid Branding & ConfigurationAccelerate your time-to-market with deployment-ready hardware that carries your brand’s authority.
Private Labeling & Chassis Branding
Professional silk-screening, laser-engraved logos, custom chassis colors, and branded packaging designed to align seamlessly with your corporate identity.
Agile Hardware & I/O Configuration
Tailored I/O panel modifications, pre-installed memory/storage matrixes, and optimized default BIOS settings, allowing the hardware to be drop-shipped directly to your end-users.
Requirements review
Engineer-led feasibility review with a solution proposal within 48 hours.
Sample & validation
Standard platforms sampled in 10 days; custom carrier boards in 4 weeks.
Pilot run
Small-batch production with full test reports and serial-number traceability.
Mass production
Volume manufacturing with a 10-year supply commitment and ECO risk management.
Industrial PC Technical Resources for System Architects
Self-service resources for system architects and integration teams. Documentation written by engineers — completeness over brevity.
3D STEP models & DXF
Validate fit, clearance, and thermal budgets before procurement — sub-millimeter precision.
Submit Technical RequestLinux BSPs & SDKs
Ubuntu, Debian, and RT-Linux support packages with GPIO, CAN, and watchdog APIs.
Linux BSP downloads Submit Technical RequestWhitepapers & diagnostics
Thermal architecture, EMC compliance, isolation topology, CAN 60 Ω rule diagnostics.
Engineering centerIndustrial computing case studies
Deployed, measured, still running.

Ruggedizing vehicle-mounted fleet computing in Denmark
AX-234BT industrial motherboards deployed as the central control unit in milk transport and waste management trucks — surviving dirty power, EMI, and continuous vibration with 9–36V input, 4000V isolated CAN bus, and burn-in QC.

Custom 10.1″ IP65 panel PC for municipal gardens
AP-AW1S outdoor alarm and monitoring terminal, engineered with IP65 sealing, aviation locking connectors, and fanless construction for 50+ municipal garden deployments.
Engineering FAQs
Questions engineers ask before they specify
Lead times, isolation ratings, lifecycle, BSPs and deployment limits — answered without the marketing layer.
What is the typical sample lead time?
It depends on the level of customization:
- Standard platforms (AE and AP series) — samples ship within 10 days.
- Custom carrier board — approximately 4 weeks to sample and validate.
- Fully custom mainboard designed to your mechanical envelope — 1–3 months from requirements review to first articles.
Is there an MOQ for OEM or private-label programs?
Yes. Turnkey OEM and private-label programs start at a minimum order quantity of 100 units. Non-recurring engineering costs are quoted upfront, before you commit — so budgeting for bespoke I/O, enclosure and BIOS requirements is transparent from the start.
Do you provide schematic review and integration support?
Yes. Our application engineers provide integration support including 3D STEP models for mechanical fit, Linux BSPs and SDKs, and schematic reviews for customized carrier board designs — so the hardware integrates cleanly into your architecture rather than being handed over at the box.
How do you support a 10-year lifecycle for industrial PCs?
Through strict bill of materials control and a modular System-on-Module architecture. Decoupling the compute module from the carrier board lets us manage component obsolescence proactively: when a component reaches end of life, we provide a pin-compatible upgrade path, so you avoid a full mechanical redesign or re-certification.
Changes are handled under formal PCN with last-time-buy notice issued before anything moves.
What operating systems and BSPs do you support?
Kernel-level support and custom Board Support Packages for Ubuntu, Debian and RT-Linux, alongside Windows 10 / 11 IoT Enterprise compatibility on x86 platforms. Our BSPs include documented APIs for native CAN, GPIO and watchdog timer integration.
One constraint worth knowing early: Arm platforms such as RK3588 run Linux or Android only — if your application requires Windows, the x86 platforms are the path.
How do your fanless computers manage heat in extreme environments?
Through passive cooling engineered per platform. Custom extruded aluminium chassis act as the heatsink, combined with controlled thermal pad placement and thermal simulation during mechanical design.
Systems operate reliably from −40 °C to +60 °C, with selected platforms rated to +80 °C. Because there are no fans, there are no vents to admit dust and no bearings to fail.
What quality assurance tests are performed before shipment?
Every unit — not a statistical sample — passes an 18-hour full-load burn-in before leaving our Shenzhen facility, with serial-number traceability and component lot tracking.
Products are compliant with CE, FCC, RoHS and UKCA, and are tested to MIL-STD-810G methods for shock and vibration for mobile and heavy-industrial deployments.
How do your systems handle ground loops and interface integrity?
Isolated platforms provide galvanic isolation rated to 4000 V withstand on COM, DIO and CAN interfaces — an electrical firewall that stops ground loops and field surges at the interface, before they cascade into the core.
For motion and fieldbus systems we use native hardware CAN / CAN FD controllers with deterministic timing, rather than software-emulated USB bridges, so bus timing stays predictable under load.
Isolation is specified per deployment rather than fixed on every model: a motor-drive network or vehicle bus gets it; a clean cabinet install on a unified ground doesn't need to pay for it.
Can your computers be deployed on vehicles or outdoors?
Yes — both are core deployments for us, not exceptions.
Vehicles and mobile equipment: wide-range 9–36 V DC input with ignition control, low-voltage cutoff to prevent battery drain when parked, and transient protection tested to ISO 7637-2 and ISO 16750-2, together with 4000 V isolated CAN and RS-485 for the vehicle bus.
Outdoor and roadside: sealed enclosures rated IP65 and above, fanless wide-temperature construction, and aviation (circular locking) connectors where standard ports would compromise the seal.
Question not answered here? Ask our engineering team →
Start a project
Tell us the deployment, not the part number
Send us the environment, what each line connects to, and what has already failed with your current hardware. An engineer — not a sales desk — replies within 2 business days with a preliminary assessment.
- Standard model pricing, custom board design, or a full OEM programme
- NRE quoted upfront, before you commit to anything
- NDA signed before you share detailed specifications
Prefer email? sales@bitechipc.com · WhatsApp +86 135 3816 4607